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SOLDER ALLOY, SOLDER BALL LEAD, SOLDER FOR MICROCIRCUIT CHIP, SOLDER PASTE AND SOLDERED JOINT
SOLDER ALLOY, SOLDER BALL LEAD, SOLDER FOR MICROCIRCUIT CHIP, SOLDER PASTE AND SOLDERED JOINT
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机译:焊锡合金,焊锡球铅,微电路芯片焊锡,焊锡膏和焊点
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摘要
FIELD: metallurgy.;SUBSTANCE: invention relates to soldering, particularly, to soldering of microcircuits. Said alloy contains 0.005 wt. % to 0.1 wt. % Mn, 0.001 wt. % to 0.1 wt. % Ge and more than 0 wt. % to 4 wt. % Ag. Main ingredient of the alloy is Sn. Due to said content of Mn and Ge in solder alloy, most of Ge oxides are distributed on outer surface of oxide film containing oxides of Sn, oxides of Mn and Ge oxides, creating effect of preventing change of colour at high humidity. In addition, Mn and O2 are reacted by suppressing the formation of oxides between Sn and O2, which provides suppression of thickness of oxide film and improves properties of soldered connection.;EFFECT: solder alloy can be used in solder ball lead, solder for IC, solder paste and soldered joint.;12 cl, 3 dwg, 3 tbl
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