SEMICONDUCTOR ARRANGEMENT, METHOD FOR PRODUCING A NUMBER OF CHIP ASSEMBLIES, METHOD FOR PRODUCING A SEMICONDUCTOR ARRANGEMENT, AND METHOD FOR OPERATING A SEMICONDUCTOR ARRANGEMENT

摘要

Semiconductor device comprising: an upper contact plate (41) and a lower contact plate (42); a number of chip assemblies (2), each having: - A semiconductor chip (1) having a semiconductor body (10), wherein the semiconductor body (10) has an upper side and an upper side opposite the upper side, and wherein the upper side in a vertical direction (v) is spaced from the underside; - An upper main electrode arranged on the top (11); - A arranged on the bottom lower main electrode (12); - a control electrode (13) arranged at the top, by means of which an electric current can be controlled between the upper main electrode (11) and the lower main electrode (12); and - An electrically conductive upper compensating plate (21) disposed on the semiconductor body (10) facing away from the upper main electrode (11) and by means of an upper connecting layer (31) to the upper main electrode (11) is integrally connected and electrically conductive; a dielectric investment material (4), by means of which the chip assemblies (2) are materially connected to one another in a solid composite (6), the side of the upper compensation chip (21) facing away from the semiconductor body (10) in each of the chip assemblies (2) relevant chip assembly (2) are not or at least not completely covered by the investment material (4); a control electrode interconnection structure (70) disposed on the fixed structure (6) and electrically connecting the control electrodes (13) of the chip assemblies (2) with each other; in which each of the chip assemblies (2) being arranged between the upper contact plate (41) and the lower contact plate (42) such that in this chip assembly (2) the side of the upper compensation chip (21) facing away from the semiconductor body (10) is the upper contact plate (12). 41) contacted electrically.