首页> 外国专利> MULTIPLY POLYMER COMPOSITE DEVICE WITH ENCLOSED COMPONENTS, METHOD FOR PRODUCING MULTIPLY POLYMER COMPOSITE DEVICES WITH ENCLOSED COMPONENTS AND DEVICE FOR PRODUCING MULTIPLY POLYMER COMPOSITE DEVICES WITH ENCLOSED COMPONENTS

MULTIPLY POLYMER COMPOSITE DEVICE WITH ENCLOSED COMPONENTS, METHOD FOR PRODUCING MULTIPLY POLYMER COMPOSITE DEVICES WITH ENCLOSED COMPONENTS AND DEVICE FOR PRODUCING MULTIPLY POLYMER COMPOSITE DEVICES WITH ENCLOSED COMPONENTS

机译:带密封部件的聚合物复合装置,带密封部件的聚合物复合装置的制造方法和带密封部件的聚合物复合装置的制造装置

摘要

A polymer composite device comprises a first thermoplastic covering layer of a polymer material with a first softening temperature and a second thermoplastic covering layer of a polymer material with a second softening temperature. The polymer composite device also comprises a carrier layer, which is arranged between the first covering layer and the second covering layer. An inner layer, which comprises at least a first thermoplastic inner layer ply of a polymer material with a third softening temperature, is arranged between the first covering layer and the second covering layer. The inner layer at least partially surrounds the carrier layer in a material-bonding manner. The third softening temperature is lower than the first softening temperature and lower than the second softening temperature.
机译:聚合物复合装置包括具有第一软化温度的聚合物材料的第一热塑性覆盖层和具有第二软化温度的聚合物材料的第二热塑性覆盖层。聚合物复合材料器件还包括载体层,其设置在第一覆盖层和第二覆盖层之间。内层布置在第一覆盖层和第二覆盖层之间,该内层至少包括具有第三软化温度的聚合物材料的第一热塑性内层。内层以材料结合的方式至少部分地包围载体层。第三软化温度低于第一软化温度且低于第二软化温度。

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