首页> 外国专利> LOCAL POLISHING PROCESSING METHOD, LOCAL POLISHING PROCESSING DEVICE, AND CORRECTIVE POLISHING PROCESSING DEVICE USING THE SAME

LOCAL POLISHING PROCESSING METHOD, LOCAL POLISHING PROCESSING DEVICE, AND CORRECTIVE POLISHING PROCESSING DEVICE USING THE SAME

机译:局部抛光处理方法,局部抛光处理设备以及使用相同方法的校正抛光处理设备

摘要

PROBLEM TO BE SOLVED: To provide a local polishing processing technique which stabilizes the amount of local polishing processing, which can obtain high corrective spatial resolution, and which is suitable for corrective polishing processing.;SOLUTION: Pressing polishing processing is performed while a polishing processing fluid, in which abrasive grains 81 composed of organic particles with an average particle diameter of 5 μm or more are dispersed in a liquid, is supplied between a workpiece 9 and a workpiece-polishing rotary tool 11 for being locally pressed against the workpiece 9. The rotary tool 11 is made of an elastic material.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2020,JPO&INPIT
机译:要解决的问题:提供一种局部抛光处理技术,该技术可以稳定局部抛光处理的量,可以获得较高的校正空间分辨率,并且适合于校正抛光处理。;解决方案:在抛光处理的同时执行加压抛光处理在工件9与工件研磨用旋转工具11之间,供给有由平均粒径为5μm以上的有机粒子构成的磨粒81分散在液体中的流体,以局部地压在工件9上。旋转工具11是由弹性材料制成的。;部分图纸:图1;版权:(C)2020,JPO&INPIT

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号