WIRING LINE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE, MULTILAYER WIRING LINE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT, METHOD FOR FORMING PATTERN STRUCTURE, MOLD FOR IMPRINTING AND METHOD FOR MANUFACTURING THE SAME, IMPRINT MOLD SET, AND METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD

摘要

To form a pattern structure with high accuracy that has a through hole for forming an interlayer connection via and a recessed portion for forming a wiring line.SOLUTION: A method for forming a pattern structure is provided, which includes: a supplying step of supplying a photocurable resist 131 on a transfer substrate 121; a contact step of preparing a mold 111 having a mold substrate and an uneven structure located on a main surface of the mold substrate, in which the uneven structure includes a linear protrusion-shaped portion 114 for forming a wiring line and a circular protrusion-shaped portion 115 for forming a pad portion, and a light-shielding layer 116 is present on a plane surface at the apex of the circular protrusion-shaped portion for forming a pad, and then bringing the mold close to the transfer substrate to form a photocurable resist layer 132; a curing step of irradiating the photocurable resist layer with light through the mold 111 side to cure into an insulation material layer 133 as well as allowing the photocurable insulation resist layer located between the light-shielding layer of the mold and the transfer substrate to remain as unexposed; a releasing step of removing the mold from the insulation material layer; and a developing step of developing the insulation material layer.SELECTED DRAWING: Figure 4