SOLDER PASTE RECOVERY DEVICE AND SOLDER PASTE RECOVERY METHOD
展开▼
机译:焊锡膏回收装置及焊锡膏回收方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
To provide a solder paste recovery device which can recover a solder paste in a short time without increase in size of a printer.SOLUTION: A solder paste recovery device includes: a body which is supported at a prescribed height from a printing object surface; a slide mechanism which slides the body along the printing object surface; a body vertical mechanism which vertically moves the body with respect to the printing object surface; a squeegee which is connected to the body and whose longitudinal direction is vertical to the slide direction; a squeegee vertical mechanism which vertically moves the squeegee with respect to the printing object surface; and a solder paste storage plate which is connected to a rotational shaft in parallel with the longitudinal direction of the squeegee provided on the body, and has a curved surface curved to the same side as the rotation circumference. The rotation of the solder paste storage plate is controlled on both sides in the slide direction of the body through the lower side of the squeegee.SELECTED DRAWING: Figure 1
展开▼