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SOLDER PASTE RECOVERY DEVICE AND SOLDER PASTE RECOVERY METHOD

机译:焊锡膏回收装置及焊锡膏回收方法

摘要

To provide a solder paste recovery device which can recover a solder paste in a short time without increase in size of a printer.SOLUTION: A solder paste recovery device includes: a body which is supported at a prescribed height from a printing object surface; a slide mechanism which slides the body along the printing object surface; a body vertical mechanism which vertically moves the body with respect to the printing object surface; a squeegee which is connected to the body and whose longitudinal direction is vertical to the slide direction; a squeegee vertical mechanism which vertically moves the squeegee with respect to the printing object surface; and a solder paste storage plate which is connected to a rotational shaft in parallel with the longitudinal direction of the squeegee provided on the body, and has a curved surface curved to the same side as the rotation circumference. The rotation of the solder paste storage plate is controlled on both sides in the slide direction of the body through the lower side of the squeegee.SELECTED DRAWING: Figure 1
机译:提供一种焊膏回收装置,该焊膏回收装置可以在短时间内回收焊膏而不会增加打印机的尺寸。解决方案:焊膏回收装置包括:主体,其从打印对象表面支撑在预定高度处;滑动机构使主体沿着打印对象表面滑动;主体垂直机构,其使主体相对于打印对象表面垂直移动;刮板,其连接到主体并且纵向垂直于滑动方向;刮板垂直机构,使刮板相对于打印对象表面垂直移动;焊膏存储板,其与设置在主体上的刮板的长度方向平行地与旋转轴连接,并具有向与旋转周向相同的一侧弯曲的曲面。锡膏存储板的旋转是通过刮板的下侧在主体滑动方向的两侧进行控制的。

著录项

  • 公开/公告号JP2020069727A

    专利类型

  • 公开/公告日2020-05-07

    原文格式PDF

  • 申请/专利权人 NEC CORP;

    申请/专利号JP20180205710

  • 发明设计人 MAGARIYA MITSUMASA;

    申请日2018-10-31

  • 分类号B41F15/40;B41F15/08;H05K3/34;H05K3/12;

  • 国家 JP

  • 入库时间 2022-08-21 11:35:16

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