Pretreatment liquid for electrolytic copper plating and electrolytic copper plating method

摘要

PROBLEM TO BE SOLVED: To provide a technique, regarding the pretreatment of copper electroplating, imparting excellent appearance to the obtained copper film and satisfactorily copper-filling a via hole.SOLUTION: Provided is a pretreatment liquid for copper electroplating containing the alkylene oxide-added matter of alkanediol represented in the (1), where, by performing copper electroplating after the object to be plated is treated, oil components are satisfactorily removed to attain copper filling causing no generation of unevenness in cloud in an electric phonograph film, and further attaining smooth copper filling even in a via hole having a high aspect ratio: H-(OA)m-O-R-O-(AO)n-H (1) ( A denotes 2 to 4C alkylene; n denotes an integer of 1 to 20; and R denotes a 3 to 20C alkylene chain).SELECTED DRAWING: Figure 1