Copper alloy material, manufacturing method of copper alloy material, lead frame and connector

摘要

PROBLEM TO BE SOLVED: To provide a technology for further improving conductivity, strength, stress relaxation resistance in copper alloy materials.SOLUTION: Provided is a copper alloy containing 0.2 mass% or more and 0.6 mass% or less of iron, 0.02 mass% or more and 0.06 mass% or less of nickel, 0.07 mass% or more and 0.3 mass% or less of phosphorus, 0.01 mass% or more and 0.2 mass% or less of magnesium, and 0.05 mass % to 0.2 mass% or less of tin, and the balance is composed of copper and inevitable impurities, and in which the conductivity is 72% IACS or more, the 0.2% proof stress is 520 MPa or more, and the stress relaxation rate after heating for 1000 hours under 150°C condition is 25% or less.SELECTED DRAWING: None