Method for evaluating fluidity of resin composition, method for selecting resin composition, and method for manufacturing semiconductor device

摘要

The present disclosure relates to a method for evaluating fluidity of a resin composition. This method comprises the steps of preparing a sample made of a resin composition, and measuring the shear elastic modulus of the sample at a temperature T while giving strain to the sample, so that the shear elastic modulus of the sample at the temperature T changes with time. And a step of grasping.