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Controlling dry etch process characteristics using waferless dry clean optical emission spectroscopy
Controlling dry etch process characteristics using waferless dry clean optical emission spectroscopy
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机译:使用无晶圆干式清洁光发射光谱法控制干法蚀刻工艺特性
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摘要
Described herein are architectures, platforms and methods for acquiring optical emission spectra from an optical emission spectroscopy system by flowing a dry cleaning gas into a plasma processing chamber of the plasma processing system and igniting a plasma in the plasma processing chamber to initiate the waferless dry cleaning process.
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