首页>
外国专利>
Thermal management of RF devices using embedded microjet arrays
Thermal management of RF devices using embedded microjet arrays
展开▼
机译:使用嵌入式微喷阵列的射频设备的热管理
展开▼
页面导航
摘要
著录项
相似文献
摘要
The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.
展开▼