首页>
外国专利>
Landless multilayer circuit board and manufacturing method thereof
Landless multilayer circuit board and manufacturing method thereof
展开▼
机译:无焊盘多层电路板及其制造方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
A landless multilayer circuit board includes a first substrate, a first circuit, at least one connecting pillar, a second substrate, and a second circuit. The second substrate is on the surface of the first substrate, covering the first circuit, and exposing at least one top of the at least one connecting pillar exposed out of a surface of the second substrate, wherein an area of a portion of the at least one connecting pillar that is exposed out of the surface of the second substrate is greater than an area of a portion of the at least one connecting pillar that is connected to the first circuit. The second circuit is on the surface of the second substrate and the at least one connecting pillar, and connected to the portion of the at least one connecting pillar that is exposed out of the surface of the second substrate.
展开▼