Method for testing semiconductor die pad untouched by probe and related test circuit

摘要

A method for testing a semiconductor die is provided. The method includes the following steps: charging a die pad of the semiconductor die to a precharge level; stopping charging the die pad to detect a period of time required for a voltage level of the die pad to change from the precharge level to a reference level, and accordingly generating a detection resu and determining a leakage current of the die pad according to the detection result.