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Integration of ex situ fabricated porous polymer monoliths into fluidic chips

机译:将异位制造的多孔聚合物整料整合到流体芯片中

摘要

Bare porous polymer monoliths, fluidic chips, methods of incorporating bare porous polymer monoliths into fluidic chips, and methods for functionalizing bare porous polymer monoliths are described. Bare porous polymer monoliths may be fabricated ex situ in a mold. The bare porous polymer monoliths may also be functionalized ex situ. Incorporating the bare preformed porous polymer monoliths into the fluidic chips may include inserting the monoliths into channels of channel substrates of the fluidic chips. Incorporating the bare preformed porous polymer monoliths into the fluidic chips may include bonding a capping layer to the channel substrate. The bare porous polymer monoliths may be mechanically anchored to channel walls and to the capping layer. The bare porous polymer monoliths may be functionalized by ex situ immobilization of capture probes on the monoliths. The monoliths may be functionalized by direct attachment of chitosan.
机译:描述了裸露的多孔聚合物整料,流体碎屑,将裸露的多孔聚合物整料掺入流体碎屑中的方法以及功能化裸露的多孔聚合物整料的方法。裸多孔聚合物整料可以在模具中非原位制造。裸露的多孔聚合物整料也可以非原位官能化。将裸露的预先形成的多孔聚合物整料结合到流体芯片中可以包括将整料插入到流体芯片的通道基底的通道中。将裸露的预先形成的多孔聚合物整料结合到流体芯片中可以包括将覆盖层结合到通道基板上。裸露的多孔聚合物整料可以机械地锚固到通道壁和覆盖层上。可以通过将捕获探针异位固定在整料上来使裸露的多孔聚合物整料功能化。整料可以通过壳聚糖的直接附接而官能化。

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