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Microfabrication of disposable microfluidic devices featuring porous polymer monoliths for on-chip electrochromatography.

机译:一次性微流体装置的微细加工,具有用于芯片电色谱的多孔聚合物整料。

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A plastic injection molding process was developed for rapid, high-volume production of plastic microfluidic chips featuring a novel integrated fluidic port. The microfluidic channels are defined by a robust mold insert that is reversibly loaded onto the mold base. This solid metal mold insert was microfabricated by electrochemically depositing nickel in the open areas of a negative-tone, thick photoresist defined using contact photolithography. Chips bonded by conventional thermal lamination and a novel solvent vapor process were qualitatively compared by microscopy and quantitatively tested for bond strength by burst pressure measurement. Following device fabrication the channels were surface modified by UV-initiated polymerization reactions to create a thin, chemically reactive skin that covalently anchors the stationary phase prepared in the subsequent step. To circumvent the difficulties associated with packing beads in a microfluidic chip, porous polymer, monoliths were patterned directly within the microfluidic chip using an in situ UV-mediated preparation method. The ability to spatially confine monolith to well defined areas of the chip using UV light facilitated the patterning of a column featuring an optical detection window. Device fabrication was completed upon serially photografting the monolith surface with an ionizable monomer for support of electroosmotic flow followed by a hydrophobic monomer to increase the reverse phase retention time.
机译:开发了一种塑料注射成型工艺,以快速,大量生产具有新型集成流体端口的塑料微流控芯片。微流体通道由坚固的模具插件限定,该模具插件可逆地加载到模具基座上。通过将镍电化学沉积在使用接​​触光刻技术定义的负厚厚光致抗蚀剂的开放区域中,可以微制造这种固体金属模具插件。通过显微镜定性比较了通过常规热层压和新型溶剂蒸汽工艺粘合的芯片,并通过爆裂压力测量定量测试了粘合强度。在装置制造之后,通过紫外线引发的聚合反应对通道进行表面改性,以形成薄的化学反应性表皮,该表皮共价固定在后续步骤中制备的固定相。为了避免与将珠粒填充在微流控芯片中相关的困难,使用原位UV介导的制备方法,将多孔聚合物直接在微流控芯片内图案化整料。使用紫外光将整料空间限制在芯片上定义良好的区域的能力促进了具有光学检测窗口的色谱柱的图案化。通过用可离子化的单体连续光接枝整料表面以支持电渗流,接着是疏水性单体以增加反相保留时间,从而完成了器件制造。

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