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Pre-applied underfill film containing nano-particulate filler for 3DIC applications, compositions useful for the preparation thereof, and uses thereof
Pre-applied underfill film containing nano-particulate filler for 3DIC applications, compositions useful for the preparation thereof, and uses thereof
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机译:用于3DIC应用的包含纳米颗粒填料的预涂底部填充膜,可用于其制备的组合物及其用途
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摘要
Provided herein are compositions having a good balance between the curing speed, transparency, tackiness and/or melt viscosity thereof. In one aspect, there are provided compositions containing nano-particulate filler and the use thereof in the preparation of a variety of electronic components, e.g., three-dimensional integrated circuits. In certain aspects, there are provided three-dimensional integrated circuits prepared employing invention compositions (i.e., compositions containing nano-particulate filler), as well as methods for preparing such compositions, and the resulting three-dimensional integrated circuits. In certain aspects, there are also provided methods for improving the curing speed, transparency, tackiness and/or melt viscosity of pre-applied underfill compositions. In certain aspects, there are also provided pre-applied underfill compositions with improved processability.
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