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Apparatus for automatically and quickly detecting two-dimensional morphology for wafer substrate in real time
Apparatus for automatically and quickly detecting two-dimensional morphology for wafer substrate in real time
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机译:实时自动快速检测晶片衬底二维形态的装置
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摘要
A device for detecting a two-dimensional morphology of a wafer substrate in real time. The device comprises: a first calculation module, a second calculation module and an analysis module, wherein the first calculation module calculates the curvature CX between any two points of incidence on the wafer substrate in an X direction of a substrate to be detected according to position signals of N light spots; the second calculation module calculates the curvature CY at any one point of incidence on the wafer substrate in a moving direction, i.e. a Y direction, of the substrate to be detected according to the position signals of N light spots. The device can be adapted to a sapphire substrate on a graphite disc which rotates at a high speed.
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机译:一种用于实时检测晶片衬底的二维形态的设备。该装置包括:第一计算模块,第二计算模块和分析模块,其中第一计算模块计算晶片基板上在X方向上的任意两个入射点之间的曲率C X Sub>。根据N个光斑的位置信号进行检测的基板;第二计算模块根据N光的位置信号,计算出待测基板在晶圆基板的移动方向即Y方向上任一入射点的曲率C Y Sub>点。该装置可适应高速旋转的石墨盘上的蓝宝石衬底。
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