METHOD FOR DETERMINING A JUNCTION TEMPERATURE OF A DEVICE UNDER TEST AND METHOD FOR CONTROLLING A JUNCTION TEMPERATURE OF A DEVICE UNDER TEST

摘要

The present disclosure provides a method for controlling a junction temperature of a device under test, including applying a reverse bias to a reference diode adjacent to the device under test, obtaining a calibration current of the reference diode under the reverse bias, deriving the junction temperature of the device under test according to the reference diode, and adjusting an environment temperature when the junction temperature of the device under test is deviated from a predetermined value by a predetermined temperature range.