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REPLACEMENT BOTTOM ELECTRODE STRUCTURE PROCESS TO FORM MISALIGNMENT TOLERATE MRAM WITH HIGH YIELD

机译:更换底部电极结构的过程以形成高产错位可错贴膜

摘要

A replacement bottom electrode structure process is provided in which a patterned stack containing a MTJ pillar and a top electrode structure is fabricated and passivated on a sacrificial dielectric material plug that is embedded in a dielectric capping layer. The sacrificial dielectric material plug is then removed and replaced with a bottom electrode structure. The replacement bottom electrode structure process of the present application allows the MTJ patterning to be misalignment tolerate and fully eliminates the potential yield loss from the bottom electrode structure.
机译:提供了替代的底部电极结构工艺,其中,制造了包含MTJ柱和顶部电极结构的图案化叠层,并将其钝化在牺牲介电材料插塞中,该牺牲介电材料插塞嵌入在介电覆盖层中。然后去除牺牲介电材料塞,并用底部电极结构代替。本申请的替代的底部电极结构工艺允许MTJ图案容忍未对准并且完全消除了底部电极结构的潜在产量损失。

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