首页> 外国专利> MID-INFRARED DETECTOR USING A HEAVILY DOPED BACKPLANE TO THE DETECTOR STRUCTURE

MID-INFRARED DETECTOR USING A HEAVILY DOPED BACKPLANE TO THE DETECTOR STRUCTURE

机译:在探测器结构上使用重掺杂背板的中红外探测器

摘要

A mid-infrared detector that uses a heavily doped material (e.g., indium arsenide) as a backplane to the detector structure to improve detector performance and fabrication cost. The infrared detector includes a substrate and a backplane of heavily doped material consisting of two or more of the following materials: indium, gallium, arsenic and antimony. The backplane re-sides directly on the substrate. The infrared detector further includes a photodetector (e.g., type-I or type-II strained layer superlattice (SLS) nBn photodetector, type-I or type-II SLS pn junction photodetector, a quantum-dot infrared photodetector, a quantum well infrared photodetector, a homogeneous material pn junction photodetector) residing directly on the backplane. Additionally, the infrared detector may include a metal structure residing directly on the photodetector. In this manner, the absorption of electromagnetic energy in the photodetector is enhanced.
机译:使用重掺杂材料(例如,砷化铟)作为检测器结构的底板的中红外检测器,以提高检测器性能和制造成本。红外探测器包括衬底和重掺杂材料的底板,该材料由以下两种或更多种材料组成:铟,镓,砷和锑。背板直接位于基板上。红外探测器还包括光电探测器(例如,I型或II型应变层超晶格(SLS)nBn光电探测器,I型或II型SLS pn结光电探测器,量子点红外光电探测器,量子阱红外光电探测器(均质材料pn结光电探测器)直接位于背板上。另外,红外探测器可以包括直接位于光电探测器上的金属结构。以这种方式,增强了光电探测器中电磁能的吸收。

著录项

  • 公开/公告号US2020328320A1

    专利类型

  • 公开/公告日2020-10-15

    原文格式PDF

  • 申请/专利权人 BOARD OF REGENTS THE UNIVERSITY OF TEXAS SYSTEM;

    申请/专利号US201816641081

  • 发明设计人 DANIEL WASSERMAN;

    申请日2018-08-21

  • 分类号H01L31/103;H01L31/0232;H01L31/0304;H01L31/18;

  • 国家 US

  • 入库时间 2022-08-21 11:25:55

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