首页>
外国专利>
WIRELESS IN-SITU REAL-TIME MEASUREMENT OF ELECTROSTATIC CHUCKING FORCE IN SEMICONDUCTOR WAFER PROCESSING
WIRELESS IN-SITU REAL-TIME MEASUREMENT OF ELECTROSTATIC CHUCKING FORCE IN SEMICONDUCTOR WAFER PROCESSING
展开▼
机译:半导体晶片加工中静电卡盘力的无线原位实时测量
展开▼
页面导航
摘要
著录项
相似文献
摘要
Embodiments disclosed herein include an apparatus for measuring chucking force and methods of using such apparatuses. In an embodiment, the apparatus for measuring a chucking force comprises a substrate having a chucking surface, where the chucking surface is the surface that is supported by a chuck. In an embodiment, the apparatus further comprises a plurality of sensors over the chucking surface, where the plurality of sensors are thin film sensors with a thickness that is less than a thickness of the substrate. In an embodiment, the apparatus further comprises a wireless communication module electrically coupled to each of the plurality of sensors.
展开▼