首页>
外国专利>
HIGH-SPEED, FLEXIBLE INTEGRATED CIRCUITS AND METHODS FOR MAKING HIGH-SPEED, FLEXIBLE INTEGRATED CIRCUITS
HIGH-SPEED, FLEXIBLE INTEGRATED CIRCUITS AND METHODS FOR MAKING HIGH-SPEED, FLEXIBLE INTEGRATED CIRCUITS
展开▼
机译:高速,柔性集成电路和制造高速,柔性集成电路的方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
The present invention provides flexible devices, such as integrated circuits, having a multilevel electronic device structure including two or more electronic components. The electronic components within the structure are electrically connected by an interconnect structure having multiple interconnect levels. In addition to the multilevel electronic device structure, the flexible devices include an elastomeric material disposed around the interconnect levels, including within the spaces between the interconnect levels.
展开▼