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SEMICONDUCTOR PACKAGE, DIE ATTACH FILM, AND METHOD FOR MANUFACTURING DIE ATTACH FILM
SEMICONDUCTOR PACKAGE, DIE ATTACH FILM, AND METHOD FOR MANUFACTURING DIE ATTACH FILM
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机译:半导体封装,管芯附件膜以及制造管芯附件膜的方法
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摘要
A method for manufacturing a die attach film includes forming a plurality of posts on a support sheet. The method includes forming an adhesive layer between the posts. A thermal conductivity of the adhesive layer is lower than a thermal conductivity of the posts. The method includes removing the support sheet.
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