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Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration

机译:皮质系统的体系结构和实现,以及使用3D晶圆规模集成来构建体系结构

摘要

A processor-memory system, a stacked-wafer processor-memory system, and a method of fabricating a processor-memory system are disclosed. In an embodiment, the invention provides a processor-memory system comprising a memory area, a multitude of specialized processors, and a management processor. The specialized processors are embedded in the memory area, and each of the specialized processors is configured for performing a specified set of operations using an associated memory domain in the memory area. The management processor is provided to control operations of an associated set of the specialized processors. In one embodiment, each of the specialized processors controls a respective one associated memory domain in the memory area. In an embodiment, the processor-memory system further comprises a specialized processor wafer. The specialized processor wafer includes the memory area, and the multitude of specialized processors are embedded in the specialized processor wafer.
机译:公开了一种处理器存储器系统,堆叠晶片处理器存储器系统以及制造处理器存储器系统的方法。在一个实施例中,本发明提供了一种处理器-存储器系统,其包括存储区域,多个专用处理器和管理处理器。专用处理器被嵌入在存储区域中,并且每个专用处理器被配置为使用存储区域中的关联存储域来执行一组指定的操作。提供管理处理器以控制一组相关的专用处理器的操作。在一个实施例中,每个专用处理器控制存储器区域中的相应一个相关联的存储器域。在一个实施例中,处理器存储器系统还包括专用处理器晶片。专用处理器晶片包括存储器区域,并且多个专用处理器嵌入在专用处理器晶片中。

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