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POWER ON DIE DISCOVERY IN 3D STACKED DIE ARCHITECTURES WITH VARYING NUMBER OF STACKED DIE
POWER ON DIE DISCOVERY IN 3D STACKED DIE ARCHITECTURES WITH VARYING NUMBER OF STACKED DIE
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机译:随堆叠模具数量的变化而变化的3D堆叠模具结构中的上电模具发现
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摘要
A handshake mechanism allows die discovery in a stacked die architecture that keeps inputs isolated until the handshake is complete. Power good indications are used as handshake signals between the die. A die keeps inputs isolated from above until a power good indication from the die above indicates presence of the die above. The die keeps inputs isolated from below until the die detects power is good and receives a power good indication from the die and the die below. In an implementation drivers and receivers, apart from configuration bus drivers and receivers are disabled until a fuse distribution done signal indicates that repairs have been completed. Drivers are then enabled and after a delay to ensure signals are driven, receivers are deisolated. A top die in the die stack never sees a power good indication from a die above and therefore keeps inputs from above isolated. That allows the height of the die stack to be unknown at power on.
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