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SEMICONDUCTOR PACKAGE, INTEGRATED OPTICAL COMMUNICATION SYSTEM AND MANUFACTURING METHOD OF INTEGRATED OPTICAL COMMUNICATION SYSTEM
SEMICONDUCTOR PACKAGE, INTEGRATED OPTICAL COMMUNICATION SYSTEM AND MANUFACTURING METHOD OF INTEGRATED OPTICAL COMMUNICATION SYSTEM
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机译:半导体封装,集成光通信系统以及集成光通信系统的制造方法
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摘要
A semiconductor package includes a photonic integrated circuit, an encapsulating material, and a redistribution structure. The photonic integrated circuit includes a coupling surface, a back surface opposite to the coupling surface and a plurality of optical couplers disposed on the coupling surface and configured to be coupled to a plurality of optical fibers. The encapsulating material encapsulates the photonic integrated circuit and revealing the plurality of optical couplers. The redistribution structure is disposed over the encapsulating material and the back surface of the photonic integrated circuit, wherein the redistribution structure is electrically connected to the photonic integrated circuit.
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