ANNULAR SILICON-EMBEDDED THERMOELECTRIC COOLING DEVICES FOR LOCALIZED ON-DIE THERMAL MANAGEMENT
展开▼
机译:局部硅片热管理的环形硅嵌入式热电冷却装置
展开▼
页面导航
摘要
著录项
相似文献
摘要
An integrated circuit (IC) package comprising an IC die, the IC die having a first surface and an opposing second surface. The IC die comprises a semiconductor material. The first surface comprises an active layer. A thermoelectric cooler (TEC) comprising a thermoelectric material is embedded within the IC die between the first surface and the second surface and adjacent to the active layer. The TEC has an annular shape that is substantially parallel to the first and second surfaces of the IC die. The thermoelectric material is confined between an outer sidewall along an outer perimeter of the TEC and an inner sidewall along an inner perimeter of the TEC. The outer and inner sidewalls are substantially orthogonal to the first and second surfaces of the IC die.
展开▼