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INTEGRATED HEATER STRUCTURES IN A PHOTONIC INTEGRATED CIRCUIT FOR SOLDER ATTACHMENT APPLICATIONS
INTEGRATED HEATER STRUCTURES IN A PHOTONIC INTEGRATED CIRCUIT FOR SOLDER ATTACHMENT APPLICATIONS
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机译:用于焊料附着应用的光子集成电路中的集成加热器结构
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摘要
An apparatus including a photonic integrated circuit (PIC) coupled to an optical bench is disclosed. The PIC includes at least one grating coupler disposed thereon and the optical bench includes an optical system disposed thereon. The apparatus also includes an integrated heater at an upper surface of the PIC under the optical bench or at a bottom surface of the optical bench over the PIC. The apparatus also includes a layer of solder disposed between the PIC and the optical bench for coupling the bottom surface of the optical bench to the PIC. In some implementations, the layer of solder is in thermal communication with the integrated heater.
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