INTEGRATED HEATER STRUCTURES IN A PHOTONIC INTEGRATED CIRCUIT FOR SOLDER ATTACHMENT APPLICATIONS

摘要

An apparatus (100) including a photonic integrated circuit (PIC) (120) coupled to an optical bench (160) is disclosed. The PIC (120) includes at least one grating coupler (130) disposed thereon and the optical bench (160) includes an optical system (180) disposed thereon. The apparatus (100) also includes an integrated heater (140) at an upper surface of the PIC (120) under the optical bench (160) or at a bottom surface of the optical bench (160) over the PIC (120). The apparatus (100) also includes a layer of solder (150) disposed between the PIC (120) and the optical bench (160) for coupling the bottom surface of the optical bench (160) to the PIC (120). In some implementations, the layer of solder (150) is in thermal communication with the integrated heater (140).