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Formation of Conductive Connection Tracks in Package Mold Body Using Electroless Plating
Formation of Conductive Connection Tracks in Package Mold Body Using Electroless Plating
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机译:化学镀在封装模具体内形成导电连接线
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摘要
An electronic circuit includes a first packaged semiconductor device having a first semiconductor die including a first terminal, a first electrically conductive lead that is electrically connected to the first terminal, and a first electrically insulating mold compound that encapsulates the first semiconductor die and exposes an end portion of the first lead at an outer surface of the first mold compound. A conductive track is formed in the outer surface of the first mold compound.
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