首页> 外国专利> COMPOSITE OF THERMALLY-MODIFIED POLYMER LAYER AND INORGANIC SUBSTRATE, COMPOSITE OF POLYMER MEMBER AND INORGANIC SUBSTRATE, AND PRODUCTION METHODS THEREOF

COMPOSITE OF THERMALLY-MODIFIED POLYMER LAYER AND INORGANIC SUBSTRATE, COMPOSITE OF POLYMER MEMBER AND INORGANIC SUBSTRATE, AND PRODUCTION METHODS THEREOF

机译:热改性的聚合物层和无机基质的复合材料,聚合物成员和无机基质的复合材料及其制备方法

摘要

[PROBLEM TO BE SOLVED];To provide a composite of thermally-modified polymer layer and inorganic substrate, a composite of polymer member and inorganic substrate, and production methods thereof.;[MEANS TO SOLVE THE PROBLEM];The method of the present invention for producing a composite of thermally-modified polymer layer and inorganic substrate 110 or 120 includes forming a first polymer layer on an inorganic substrate 10, and heating and thermally modifying the first polymer layer in order to bond the first thermally-modified polymer layer 20 onto the inorganic substrate. In addition, the method of the present invention for producing a composite of polymer member and inorganic substrate 210 or 220 includes producing a composite of thermally-modified polymer layer and inorganic substrate by the method of the present invention and joining the polymer member to the first thermally-modified polymer layer so that the polymer member 30 is joined to an inorganic substrate via the first thermally-modified polymer layer.
机译:[要解决的问题];提供热改性的聚合物层和无机基材的复合材料,聚合物构件和无机基材的复合材料及其生产方法。[解决问题的方法];本发明的方法用于生产热改性聚合物层和无机基材 110 120 的复合材料的步骤包括在无机基材 10 上形成第一聚合物层,以及加热并热改性第一聚合物层,以将第一热改性聚合物层 20 粘结到无机基材上。另外,本发明的制备聚合物构件和无机基材 210 220 的复合材料的方法包括通过以下方法制备热改性的聚合物层和无机基材的复合材料:在本发明的方法中,将聚合物构件与第一热改性聚合物层接合,使得聚合物构件 30 通过第一热改性聚合物层与无机基材接合。

著录项

  • 公开/公告号US2020101675A1

    专利类型

  • 公开/公告日2020-04-02

    原文格式PDF

  • 申请/专利权人 TEIJIN LIMITED;

    申请/专利号US201916578674

  • 发明设计人 JUNSHI SOEDA;YOSHINORI IKEDA;

    申请日2019-09-23

  • 分类号B29C65/48;B29C65;B29C65/64;B29D7/01;

  • 国家 US

  • 入库时间 2022-08-21 11:20:46

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