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Printed circuit boards and methods for manufacturing thereof for RF connectivity between electro-optic phase modulator and Digital Signal Processor
Printed circuit boards and methods for manufacturing thereof for RF connectivity between electro-optic phase modulator and Digital Signal Processor
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机译:用于电光相位调制器和数字信号处理器之间的RF连接的印刷电路板及其制造方法
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摘要
A Printed Circuit Board (PCB) and methods for manufacturing the PCB board are provided. The PCB includes a Radio Frequency (RF) signal transition at a RF signal pad. Multiple conductive layers other than a conductive signal layer of the PCB and conductive portions of the conductive signal layer not in electrical contact with a RF signal transmission trace have common ground connections forming a ground cage structure within the PCB around the RF signal pad and RF the signal transmission trace.
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