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Direct write plasma spraying technology applied to the semiconductor industry

机译:直接写入等离子喷涂技术应用于半导体行业

摘要

A direct-write plasma spray technique for semiconductor industry. For coated parts in semiconductors, the sensor is written on the coating by direct-write plasma spraying technology, and the change in coating quality is monitored by sensor to achieve replacing coating of the parts before the coating reaches the end of service life. The method includes, (1) coating a functional coating according to needs of semiconductor component; (2) spraying a small area of other coating over coating, wherein the coating needs to be at a certain performance and first the functional coating of layer is clearly distinguishable; the coating cannot be coated with sensitive metal coating in the semiconductor industry; (3) above the second coating, spraying coating of the same material as the first coating; wherein a thickness is slightly smaller than the first layer of coating; (4) spraying radio over the coating to connect external monitoring equipment.
机译:半导体行业的直接写入等离子喷涂技术。对于半导体中的涂层零件,通过直接写入等离子喷涂技术将传感器写入涂层,并通过传感器监视涂层质量的变化,以在涂层达到使用寿命之前更换零件的涂层。该方法包括:(1)根据半导体部件的需要涂覆功能涂层; (2)在涂层上喷涂小面积的其他涂层,其中该涂层需要具有一定的性能,首先该层的功能涂层是可明显区分的;半导体工业中不能用敏感金属涂层涂覆该涂层; (3)在第二涂层上方,喷涂与第一涂层相同材料的涂层;其中厚度略小于第一涂层层; (4)在涂层上喷涂无线电,以连接外部监控设备。

著录项

  • 公开/公告号US2020140987A1

    专利类型

  • 公开/公告日2020-05-07

    原文格式PDF

  • 申请/专利权人 SHENYANGFORTUNEPRECISIONEQUIPMENT CO.LTD;

    申请/专利号US201816631216

  • 发明设计人 JUNYANG XU;JIA LEE;YING SHAO;

    申请日2018-10-16

  • 分类号C23C4/134;C23C4/01;C23C4/11;H01L21/02;H01L35/34;H01L43/12;H01L43/08;G01N27/04;G01R27/02;

  • 国家 US

  • 入库时间 2022-08-21 11:20:04

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