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Direct write plasma spraying method applied in the semiconductor industry

机译:直接写等离子喷涂方法应用于半导体工业

摘要

PROBLEM TO BE SOLVED: To provide a direct drawing type plasma spraying method applied in the semiconductor industry. SOLUTION: A sensor is drawn on a coating layer using a direct drawing type plasma spraying technique on a member having a coating layer in a semiconductor, and a change in the quality of the coating layer is monitored by the sensor, and the life of the coating layer is extended. The coating layer of the member can be changed before the limit is reached. (1) The functional coating layer is coated based on the needs of the semiconductor member. (2) Another coating layer having a small area is sprayed on the coating layer, and the coating layer must have a remarkable difference in performance from the functional coating layer of the first layer, and the coating layer is used in the semiconductor industry. Do not use a reactive metal coating layer in. (3) The coating layer is sprayed onto the coating layer of the second layer with the same material as the coating layer of the first layer, and the thickness of the coating layer is slightly thinner than that of the coating layer of the first layer. (4) A radio is sprayed on the coating layer to connect an external monitoring device. [Selection diagram] Fig. 2
机译:要解决的问题:提供一种在半导体工业中应用的直接拉伸型等离子体喷涂方法。溶液:在涂层上使用直接拉伸型等离子体喷涂技术在具有在半导体中的涂层的构件上绘制传感器,并且通过传感器监测涂层的质量的变化,以及涂层的寿命涂层延伸。在达到极限之前可以改变构件的涂层。 (1)基于半导体构件的需要涂覆功能涂层。 (2)在涂层上喷射具有小面积的另一个涂层,并且涂层必须具有从第一层的功能涂层的性能具有显着差异,并且涂层用于半导体工业中。不要使用反应性金属涂层。(3)用与第一层的涂层相同的材料将涂层喷射到第二层的涂层上,并且涂层的厚度略微薄第一层的涂层的涂层。 (4)在涂层上喷射无线电以连接外部监测装置。 [选择图]图2

著录项

  • 公开/公告号JP6920426B2

    专利类型

  • 公开/公告日2021-08-18

    原文格式PDF

  • 申请/专利权人 瀋陽富創精密設備有限公司;

    申请/专利号JP20190517890

  • 发明设计人 徐 俊陽;李 加;邵 穎;

    申请日2018-10-16

  • 分类号C23C4/134;C23C4/08;C23C4/11;H01L21/3065;

  • 国家 JP

  • 入库时间 2022-08-24 20:38:56

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