METAL BASED CERAMIC FILLERS AS CATALYSTS FOR SELECTIVE ELECTROLESS METAL PLATING

摘要

Embodiments include methods for selective electroless plating of dielectric layers and devices formed by such processes. According to an embodiment, patterned surfaces are formed in a dielectric layer that includes metallic ceramic fillers. In some embodiments, the patterned surfaces form a line opening and a via opening that exposes a conductive pad. In an embodiment, the metallic ceramic fillers are activated to form activated surfaces over the patterned surfaces. A first metal is then deposited into the via opening with a first electroless solution that is a bottom-up deposition process. Thereafter, embodiments include forming a seed layer over exposed portions of the activated surfaces. In an embodiment, mid-gap states of the activated surfaces have an energy level approximately equal to a reduction potential of metal ions in a second electroless solution. Embodiments may then include depositing a second metal into the via opening with a third electroless solution.