METHOD FOR MANUFACTURING AN ELECTRONIC POWER MODULE, SUBSTRATE FOR AN ELECTRONIC POWER MODULE, AND, ELECTRONIC POWER MODULE

摘要

a method for manufacturing an electronic power module (20) by additive manufacturing, the electronic module (20) comprising a substrate (21) including an electrically insulating plate (24) having first and second opposite faces (24a, 24b) and a first metallic layer (25a) which is arranged directly on the first face (24a) of the insulating plate (24) and a second metallic layer (25b) which is arranged directly on the second face (25b) of the insulating plate (24). at least one of the metallic layers (25a) is produced by means of a step (100) of depositing a thin layer of copper and a step (110) of annealing the metallic layer (25a, 25b) and the method additionally comprises a step ( 120) to form at least one thermomechanical transition layer (271 to 273, 274 to 276) over at least one of the first and second metallic layers (25a, 25b), said at least one thermomechanical transition layer (271 to 273 , 274 to 276) including a material having a thermal expansion coefficient lower than that of the metal of the metallic layer (25a, 25b).