PROTOTYPE FORMULATION OF RESIN MOLD FOR PHOTOCURING RAPID MOLDING AND INVESTMENT CASTING PROCESS THEREOF

摘要

Disclosed is a resin mold for photocuring rapid molding, comprising, in weight percentages: a photosensitive resin: 60-95 wt%, and an inert low molecular weight substance: 5-40 wt%, wherein the photosensitive resin comprises: 10-70 wt% of an active oligomer, 20-70 wt% of an active diluent, 0.2-6 wt% of a photoinitiator, and the balance of a functional auxiliary agent. Also disclosed are a method for preparing a photocuring system, a photocuring molding process and a method for baking a mold. A casting method using the resin mold has the advantages of a low cost, a high efficiency, being not prone to deform, and being able to produce a thinner casting.