ELECTRONIC ASSEMBLY AND PRESSURE MEASUREMENT DEVICE WITH IMPROVED DURABILITY

摘要

A device (10) comprising an electronic assembly (1) comprising an electronic component (2) assembled on a first substrate (3), and a body (11) defining a cavity (12), a first end (12.1) of which is in fluid communication with a fluid (14), the electronic component extending into the cavity (12) and the first substrate (3) comprising a portion (7.1, 7.3) in contact with a wall of the cavity (12), wherein the thermal expansion coefficient of the material of the first substrate (3) is less than that of the electronic component (2), and the electronic component (2) is assembled using an assembly method with the addition of brazing type heat on the first substrate (3). A method for producing an electronic assembly. An assembly (1) obtained by the method.