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PROCESSING DEVICE EMPLOYING PLASMA, AND PROCESSING METHOD FOR PERFORMING PROCESS TO IRRADIATE PROCESSING TARGET WITH PLASMA
PROCESSING DEVICE EMPLOYING PLASMA, AND PROCESSING METHOD FOR PERFORMING PROCESS TO IRRADIATE PROCESSING TARGET WITH PLASMA
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机译:等离子体加工装置及等离子体辐射加工目标的加工方法
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摘要
In order to provide a processing device and a processing method employing plasma with which stability of maintaining a plasma lighting state is improved, while microwaves having a pulsed microwave power are used as the microwaves for generating the plasma, a processing device (10) employing plasma (25), according to the present invention, is provided with a processing chamber (14) for performing a process to irradiate a processing target (13) with the plasma (25), and a microwave supply unit (17) which supplies microwaves for generating the plasma (25) into the processing chamber (14), wherein the microwave supply unit (17) supplies first microwaves having a pulsed first microwave power in which a difference between a maximum value and a minimum value of the microwave power is at least equal to a first amplitude, and second microwaves having a steady second microwave power with little variation in the microwave power.
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