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VAPOR SOURCE FOR DEPOSITING AN EVAPORATED MATERIAL, NOZZLE FOR A VAPOR SOURCE, VACUUM DEPOSITION SYSTEM, AND METHOD FOR DEPOSITING AN EVAPORATED MATERIAL
VAPOR SOURCE FOR DEPOSITING AN EVAPORATED MATERIAL, NOZZLE FOR A VAPOR SOURCE, VACUUM DEPOSITION SYSTEM, AND METHOD FOR DEPOSITING AN EVAPORATED MATERIAL
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机译:用于沉积蒸发的材料的蒸气源,用于蒸气源的喷嘴,真空沉积系统以及用于沉积蒸发的材料的方法
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摘要
Embodiments described herein relate to a vapor source (100) for depositing an evaporated material on a substrate (10) in a vacuum chamber. The vapor source (100) comprises a distribution pipe (110) with a plurality of nozzles, wherein at least one nozzle of the plurality of nozzles comprises a first nozzle section (121) extending along a nozzle axis (A) and having 5 a vapor release opening (123) configured to release a plume (115) of evaporated material, and a second nozzle section (122) downstream of the first nozzle section (121) comprising a shaping passage (125) with a dimension that at least in sections decreases toward a nozzle outlet (126). Embodiments further relate to a nozzle for a vapor source, a vacuum deposition system with a vapor source, and a method for depositing an evaporated material on a substrate 10 in a vacuum chamber.
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