FILM LAYER THICKNESS ADJUSTMENT METHOD AND FILM LAYER THICKNESS ADJUSTMENT APPARATUS

摘要

A film layer thickness adjustment method, the film layer being formed by means of evaporation plating by a linear evaporation source, and the film layer thickness adjustment method comprising: acquiring a plurality of film thickness measurement values corresponding on a one-to-one basis with a plurality of measurement points on the film layer; on the basis of the plurality of film thickness measurement values, calculating a slope inclination parameter and a horizontal uniformity parameter of the film layer; the slope inclination parameter is used for representing the slope of the film layer and the horizontal uniformity parameter is used for representing the surface evenness of the film layer; and, on the basis of the slope inclination parameter and/or the horizontal uniformity parameter, adjusting the evaporation plating processing parameters of the linear evaporation source in order to adjust the thickness of a film layer formed by means of evaporation plating by the linear evaporation source.