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ETCHING END-POINT DETECTING DEVICE, SUBSTRATE PROCESSING SYSTEM, ETCHING END-POINT DETECTING METHOD, AND CLASSIFIER

机译:蚀刻终点检测装置,基板处理系统,蚀刻终点检测方法及分类器

摘要

[Problem] To provide an etching end-point detecting device, for example, which does not require a spectroscope for detecting an end-point of etching. [Solution] An etching end-point detecting device 20 comprises: a process log acquiring unit 21 which acquires process log data of a substrate processing device 10 that subjects a substrate W disposed in a chamber 1 to processing, such as plasma processing; and a detecting unit 22 which, on the basis of the process log data acquired by the process log acquiring unit, creates input data other than a measurement value concerning light generated in the chamber, detects an end-point of etching in the substrate processing device on the basis of the input data. The detecting unit is provided with a classifier 25 which is generated by means of machine learning and into which the input data is input, wherein the classifier produces an output indicating a point before or after the end-point of etching in the substrate processing device.
机译:[问题]例如,提供一种蚀刻终点检测装置,其不需要分光镜来检测蚀刻终点。 [解决方案]蚀刻终点检测装置20包括:处理日志获取单元21,其获取对处理室1中布置的基板W进行等离子处理的基板处理设备10的处理日志数据;检测单元22,其基于由处理日志获取单元获取的处理日志数据,创建除关于腔室中产生的光的测量值以外的输入数据,以检测基板处理装置中的蚀刻终点。根据输入数据。检测单元设置有分类器25,该分类器25是通过机器学习生成的,输入数据被输入到该分类器中,其中该分类器产生指示衬底处理装置中的蚀刻终点之前或之后的点的输出。

著录项

  • 公开/公告号WO2020144823A1

    专利类型

  • 公开/公告日2020-07-16

    原文格式PDF

  • 申请/专利权人 SPP TECHNOLOGIES CO. LTD.;

    申请/专利号WO2019JP00576

  • 发明设计人 FUJIWARA YUKI;

    申请日2019-01-10

  • 分类号H01L21/3065;

  • 国家 WO

  • 入库时间 2022-08-21 11:10:13

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