A housing for an electronic device is described. The housing comprises a substrate. The substrate comprises a magnesium alloy. An electrophoretic polymer layer overlies 5 the substrate. A coating layer is positioned between the substrate and the electrophoretic polymer layer. The coating layer comprises (i) a layer comprising a chelating agent and a metal ion or chelated metal complex thereof, (ii) a passivation layer or (iii) a passivation layer and a layer comprising a chelating agent and a metal ion or chelated metal complex thereof. A method for 10 manufacturing the housing is also described.
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