REDUCING SUSCEPTIBILITY OF INTEGRATED CIRCUITS AND SENSORS TO RADIO FREQUENCY INTERFERENCE

摘要

An apparatus comprises a ground plane (2), an integrated circuit chip (1) disposed on the ground plane (2), the integrated circuit chip (1) comprising one or more electrically conductive layers (10) encircling a periphery of the integrated circuit chip (1), and a plurality of bondwires (9) electrically coupling the one or more electrically conductive layers (10) to the ground plane (2).