PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN SHEET, CURED FILM, METHOD FOR PRODUCING CURED FILM, ORGANIC EL DISPLAY DEVICE AND ELECTRONIC COMPONENT

摘要

The present invention addresses the problem of providing a photosensitive resin composition which exhibits good imidization rate even in cases where the photosensitive resin composition is fired at a temperature of 200°C or less, while having high pattern processability, and a cured film of which exhibits high long-term reliability if used in an organic EL display device.　In order to solve the above-described problem, a photosensitive resin composition according to the present invention contains (a) a polyimide precursor, (b) a phenolic compound having an electron-withdrawing group and (c) a photosensitive compound; and the polyimide precursor (a) has a residue which is derived from a diamine that has an ionization potential of less than 7.1 eV.