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Pd-Ni Pd-Ni Alloy Plating Solution Compositions for Decoration and Plating Methods Using Thereof

机译:用于装饰的Pd-Ni Pd-Ni合金电镀液组合物和使用其的电镀方法

摘要

Provided in the present invention are a plating solution composition and a plating method using the same, which, based on 100 parts by weight of palladium sulfate, comprises: 20 to 30 parts by weight of potassium hydroxide; 30 to 40 parts by weight of ethylenediamine monohydrate; 110 to 130 parts by weight of potassium sulfate; and 500 to 600 parts by weight of water. According to the present invention, the Pd-Ni alloy plating solution composition can provide a low contact resistance value and excellent corrosion resistance to a plated body on which the composition is plated.
机译:本发明提供一种电镀液组合物和使用该电镀液组合物的电镀方法,其基于100重量份的硫酸钯,包括:20至30重量份的氢氧化钾;和30至40重量份乙二胺一水合物; 110至130重量份的硫酸钾;和500至600重量份的水。根据本发明,Pd-Ni合金镀覆溶液组合物可以对其上镀有该组合物的镀覆体提供低接触电阻值和优异的耐腐蚀性。

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