ELECTROSTATIC CHUK SYSTEM APPARATUS FOR FORMING FILM ADSORPTION METHOD METHOD FOR FORMING FILM AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

摘要

An electrostatic chuck system of the present invention is provided to adsorb a first adsorbed object and a second adsorbed object, wherein the first adsorbed object is placed therebetween. The electrostatic chuck system includes: an electrostatic chuck having a plurality of adsorption parts; a voltage applying part applying voltage to the plurality of adsorption parts; and a voltage control part for controlling application of the voltage by the voltage applying part, wherein the voltage control part controls the voltage applying part so that adsorption voltage for adsorbing the second adsorbed object is applied in order in at least one direction from a first adsorption part of the plurality of adsorption parts of the electrostatic chuck.