ELECTROSTATIC CHUK SYSTEM APPARATUS FOR FORMING FILM ADSORPTION METHOD METHOD FOR FORMING FILM AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

摘要

An electrostatic chuck system of the present invention, which is to adsorb a body to be adsorbed, includes an electrostatic chuck plate part in which at least one cutout portion is installed. The electrostatic chuck plate part comprises: a first area adjacent to the cutout portion; and a second area arranged away from the cutout portion than the first area. Electrostatic attraction force per unit area with respect to the body to be adsorbed in the first area of the electrostatic plate part is greater than electrostatic attraction force per unit area with respect to the body to be adsorbed in the second area.