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Accelerated thermal crosslinking of PVDF-HFP through the addition of organic base and use of crosslinked PVDF-HFP as gate dielectric material for OTFT devices
Accelerated thermal crosslinking of PVDF-HFP through the addition of organic base and use of crosslinked PVDF-HFP as gate dielectric material for OTFT devices
The present disclosure describes methods for crosslinking fluoroelastomers, or more precisely, heat-crosslinkable fluorine-containing polymers, and devices such as OTFTs (organic thin film transistors) comprising such polymers. In some embodiments, the method includes mixing a solvent, a heat crosslinkable fluorine-containing polymer, and one or more organic bases to form a mixed solution. The mixed solution is deposited across the substrate to form a first layer. The first layer is crosslinked by heat treatment to form a crosslinked first layer. The polymer comprises: a homopolymer of vinylidene fluoride; And copolymers of fluorine-containing ethylenic monomers and vinylidene fluoride. The one or more organic bases each have a pKa of 10 to 14.
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