首页> 外国专利> Accelerated thermal crosslinking of PVDF-HFP through the addition of organic base and use of crosslinked PVDF-HFP as gate dielectric material for OTFT devices

Accelerated thermal crosslinking of PVDF-HFP through the addition of organic base and use of crosslinked PVDF-HFP as gate dielectric material for OTFT devices

机译:通过添加有机碱并使用交联的PVDF-HFP作为OTFT器件的栅极介电材料来加速PVDF-HFP的热交联

摘要

The present disclosure describes methods for crosslinking fluoroelastomers, or more precisely, heat-crosslinkable fluorine-containing polymers, and devices such as OTFTs (organic thin film transistors) comprising such polymers. In some embodiments, the method includes mixing a solvent, a heat crosslinkable fluorine-containing polymer, and one or more organic bases to form a mixed solution. The mixed solution is deposited across the substrate to form a first layer. The first layer is crosslinked by heat treatment to form a crosslinked first layer. The polymer comprises: a homopolymer of vinylidene fluoride; And copolymers of fluorine-containing ethylenic monomers and vinylidene fluoride. The one or more organic bases each have a pKa of 10 to 14.
机译:本公开内容描述了用于使含氟弹性体或更确切地说是可热交联的含氟聚合物交联的方法,以及包括这种聚合物的装置,例如OTFT(有机薄膜晶体管)。在一些实施方案中,该方法包括将溶剂,可热交联的含氟聚合物和一种或多种有机碱混合以形成混合溶液。混合溶液沉积在整个基材上以形成第一层。通过热处理使第一层交联以形成交联的第一层。该聚合物包括:偏二氟乙烯的均聚物;和以及含氟乙烯单体和偏二氟乙烯的共聚物。一种或多种有机碱的pKa均为10至14。

著录项

  • 公开/公告号KR20200038272A

    专利类型

  • 公开/公告日2020-04-10

    原文格式PDF

  • 申请/专利权人 코닝 인코포레이티드;

    申请/专利号KR1020207006080

  • 申请日2018-07-30

  • 分类号C08L27/16;C08F214/28;C08G61/12;C08G73;C08K5;C08K5/29;C08L27/20;C08L65;C09D127/16;H01L51;H01L51/05;

  • 国家 KR

  • 入库时间 2022-08-21 11:07:23

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