RETAINER RING FOR CMP PROCESS HAVING REDUCED PRE-POLISHING TIME

摘要

The present invention relates to a retainer ring for a CMP process having reduced pre-polishing time, and more specifically, to a retainer ring for polishing a wafer, which is coupled to one side of a carrier, and is arranged on the upper surface of a polishing pad polishing one surface of the wafer while being rotated, wherein the inner circumferential surface thereof supports the outer surface of the wafer to be polished to prevent the wafer to be polished from being dislocated. To this end, provided is the retainer ring for a CMP process having reduced pre-polishing time, which comprises: an insert ring which is made of a stainless steel material, and is coupled to one side of the carrier; and a mold unit of a synthetic resin material, which is monolithically formed with the insert ring at the lower portion of the insert ring, and of which a lower surface comes in surface contact with the upper surface of the polishing pad, and the inner circumferential surface supports the outer surface of the wafer to be polished. Here, in the mold unit, a fine groove is formed in a circumferential direction at the lower surface thereof while having the center thereof as a concentric circle. Therefore, the fine groove is formed at the lower surface of the mold unit at the area in which a groove is not formed, such that the cross-sectional area of the lower surface of the mold unit is minimized. In addition, the fine groove is formed in the circumferential direction of the mold unit, which is the polishing direction, such that time required for a pre-polishing process can be significantly reduced. Consequently, manufacturing efficiency of the wafer can be greatly improved, and the polishing process with respect to the lower surface of the mold unit can be stably performed.;COPYRIGHT KIPO 2020